SmartFusion2 SoC FPGAs Product Brief
Microsemi SmartFusion®2 SoC FPGAs integrate the fourth generation flash-based FPGA fabric, an ARM Cortex-M3 processor, and high-performance communications interfaces on a single chip. The SmartFusion2 family is the industry's lowest power, most reliable, and highest security programmable logic solution. SmartFusion2 FPGAs offer up to 3.6X the gate density, up to 2X the performance of previous flash-based FPGA families, and also include multiple memory blocks and multiply accumulate blocks for DSP processing. The 166 MHz ARM Cortex-M3 processor is enhanced with an embedded trace macrocell (ETM), memory protection unit (MPU), 8 Kbyte instruction cache, and additional peripherals, including controller area network (CAN), Gigabit Ethernet, and high-speed universal serial bus (USB). High-speed serial interfaces include PCI Express (PCIe), 10 Gbps attachment unit interface (XAUI) / XGMII extended sublayer (XGXS) plus native serialization/deserialization (SerDes) communication, while DDR2/DDR3 memory controllers provide high-speed memory interfaces.
SmartFusion2 SoC FPGA Features
Reliability
• Single event upset (SEU) immune
--Zero FIT FPGA configuration cells
• Junction temperature
--125 °C-military temperature
--100 °C-industrial temperature
--85 °C-commercial temperature
--125 °C-automotive
• Single error correct double error detect (SECDED) protection on the following:
--Ethernet buffers
--CAN message buffers
--Cortex-M3 embedded scratch pad memory (eSRAMs)
--USB buffers
--PCIe buffer
--DDR memory controllers with optional SECDED modes
• Buffers implemented with SEU resistant latches on the following:
--DDR bridges (MSS, MDDR, and FDDR)
--Instruction cache
--MMUART FIFOs
--SPI FIFOs
• NVM integrity check at power-up and on-demand
• No external configuration memory required-instant-on, retains configuration when powered off
Security
• Design security features (available on all devices)
--Intellectual property (IP) protection through unique security features and use models new to the PLD industry
--Encrypted user key and bitstream loading, enabling programming in less-trusted locations
--Supply-chain assurance device certificate
--Enhanced anti-tamper features
--Zeroization
• Data security features
-- Non-deterministic random bit generator (NRBG)
--User cryptographic services (AES-256, SHA-256, and elliptical curve cryptographic (ECC) engine)
--User physically unclonable function (PUF) key enrollment and regeneration
--CRI pass-through DPA patent portfolio license
--Hardware firewalls protecting microcontroller subsystem (MSS) memories
Low Power
• Low static and dynamic power
--Flash*Freeze (F*F) mode for fabric
• Power as low as 13 mW/Gbps per lane for SerDes devices
• Up to 50% lower total power than competing SoC devices
High-Performance FPGA
• Efficient 4-input look-up tables (LUTs) with carry chains for high-performance and low power
• Up to 236 blocks of dual-port 18 Kbit SRAM (Large SRAM) with 400 MHz synchronous performance (512 x 36, 512 x 32, 1 kbit x 18, 1 kbit x 16, 2 kbit x 9, 2 kbit x 8, 4 kbit x 4, 8 kbit x 2, or 16 kbit x 1)
• Up to 240 blocks of three-port 1 Kbit SRAM with 2 read ports and 1 write port (micro SRAM)
• High-performance DSP signal processing
--Up to 240 fast mathblocks with 18 x 18 signed multiplication, 17 x 17 unsigned multiplication and 44-bit accumulator
Microcontroller Subsystem
• Hard 166 MHz 32-Bit ARM Cortex-M3 processor
--1.25 DMIPS/MHz
--8 Kbyte instruction cache
--Embedded trace macrocell (ETM)
--Memory protection unit (MPU)
--Single cycle multiplication, hardware divide
--JTAG debug (4 wires), serial wire debug (SWD, 2 wires), and serial wire viewer (SWV) interfaces
• 64 KB embedded SRAM (eSRAM)
• Up to 512 KB embedded nonvolatile memory (eNVM)
• Triple speed Ethernet (TSE) 10/100/1000 Mbps MAC
• USB 2.0 high speed on-the-go (OTG) controller with ULPI interface
• CAN controller, 2.0B compliant, conforms to ISO11898-1, 32 transmit and 32 receive buffers
• Two each: SPI, I2C, and multi-mode UARTs (MMUART) peripherals
• Hardware based watchdog timer
• One general purpose 64-bit (or two 32-bit) timer(s)
• Real-time calendar/counter (RTC)
• DDR bridge (4 port data R/W buffering bridge to DDR memory) with 64-bit AXI interface
• Non-blocking, multi-layer AHB bus matrix allowing multi-master scheme supporting 10 masters and 7 slaves
• Two AHB-Lite/APB3 interfaces to FPGA fabric (master/slave capable)
• Two DMA controllers to offload data transactions from the Cortex-M3 processor
--8-channel peripheral DMA (PDMA) for data transfer between MSS peripherals and memory
--High-performance DMA (HPDMA) for data transfer between eSRAM and DDR memories
Clocking Resources
• Clock sources
--Up to two high precision 32 KHz to 20 MHz main crystal oscillator
--1 MHz embedded RC oscillator
--50 MHz embedded RC oscillator
• Up to 8 clock conditioning circuits (CCCs) with up to 8 integrated analog PLLs
--Output clock with 8 output phases and 45° phase difference (multiply/divide, and delay capabilities)
--Frequency: input 1 MHz to 200 MHz, output 20 MHz to 400 MHz
High-Speed Serial Interfaces
• Up to 16 SerDes lanes, each supporting
--XGXS/XAUI extension (to implement a 10 Gbps (XGMII) Ethernet PHY interface)
--Native EPCS SerDes interface facilitates implementation of serial rapidIO (SRIO) in fabric or an SGMII interface to the Ethernet MAC in MSS
• PCI express (PCIe) endpoint controller
--×1, ×2, and ×4 lane PCI express core
--Up to 2 Kbytes maximum payload size
--64-Bit/32-Bit AXI and 64-Bit/32-Bit AHB master and slave interfaces to the application layer
High-Speed Memory Interfaces
• Up to 2 high-speed DDRx memory controllers
--MSS DDR (MDDR) and fabric DDR (FDDR) controllers
--Supports LPDDR/DDR2/DDR3
--Maximum 333 MHz DDR clock rate
--SECDED enable/disable feature
--Supports various DRAM bus width modes, ×8, ×9, ×16, ×18, ×32, ×36
--Supports command reordering to optimize memory efficiency
--Supports data reordering, returning critical word first for each command
• SDRAM support through the SMC_FIC and additional soft SDRAM memory controller
Operating Voltage and I/Os
• 1.2 V core voltage
• Multi-standard user I/Os (MSIO/MSIOD)
--LVTTL/LVCMOS 3.3 V (MSIO Only)
--LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V
--DDR (SSTL2_1, SSTL2_2)
--LVDS, MLVDS, Mini-LVDS, RSDS differential standards
--PCI
--LVPECL (receiver only)
• DDR I/Os (DDRIO)
--DDR2, DDR3, LPDDR, SSTL2, SSTL18, HSTL
--LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V
• Market leading number of user I/Os with 5G SerDes
Notice:
1. As a Diamond Member and an Audited Supplier of Made-in-China since 2014, Telefly guarantees that all the semiconductor chips and other electronic components we provide are 100% new and original, all the chips and components are from formal channels and can be traced back to original manufacturers.
2. All products we provide will be double checked and proper inspection process will be strictly followed before delivery.
3. We promise to provide at least 1 year after-sell service for all products we sell.
4. Due to the reality of sometime volatile changes of the chips and components' stock and prices, please contact with us for their availability and quoting prices before payment.
5. We use DHL, UPS, FedEx, TNT, HONGKONG Post, EUB, EMS or other global express delivery services you designate.
Company Profile
TELEFLY Telecommunications Equipment Co., Ltd. is a leading Chinese Telecommunications Equipment manufacturer and a semiconductor chip and other electronic component distributor founded in 2004, certified by SGS, CFL Certification Center. We provide high quality and price competitive semiconductor chips and other electronic components, Ethernet switch ,SFP transceiver,media converter ,patch cable, Fiber Optic Splitter and so on. Up till now, our products and solutions have been deployed in over 60 countries and regions, TELEFLY is looking forward to strengthening friendly cooperative relationships with all clients, creating benefits together and sharing the joy of success!
Company Profile
Our Advantages
Why you choose TELEFLY be one of your partner?
1.Customer get satisfied quality and service with competitive price and punctual delivery.
2.OEM service with 13-year experiences, free samples are available.
3.Prompt answer for any question and inquiry in the shortest time.
4.Factory directly,reduce your cost and save time.
1.Customer get satisfied quality and service with competitive price and punctual delivery.
2.OEM service with 13-year experiences, free samples are available.
3.Prompt answer for any question and inquiry in the shortest time.
4.Factory directly,reduce your cost and save time.
FAQ
Q1 . What your MOQ?
A1 .If not specified, 1 pcs is ok,whatever how many you need,and we will also give you the best service.
Q2.What certification did you get?
A2 : Our product strictly operate the ISO9001:2008 quality control system and we passed the CE,FCC,ROHS and SGS test,you can trust us.
Q3 :What about your package and delivery,will it broke during shipping?
A3:You don't need to worry about the package,we will use shockproof case for delivering.
Q4.What your common delivery way?
A4:By air, by sea or express(UPS,DHL,Fedex,TNT,EMS...)We will make a perfect delivery plan for you.
Q5.Tell me some detail about warrant time.
A5:We give you the promise if any question during 1 year and not cause by human factors,we will fix it.
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